ISPSD 2014 Exhbition
ISPSD 2014 will provide an opportunity for companies to exhibit their products and services to conference attendees. Exhibits will be located near the conference registration desk, conventiently placed for attendees to visit during scheduled coffee breaks. A list of previous ISPSD Exhibitors can be found below. For more information about registeering as an Exhibitor, please see the form (here).
Company Name Year Package FEI Company Japan Ltd. 2013 Exhibitor Azzurro Semiconductors AG 2013 Exhibitor DCG Systems 2013 Exhibitor Marubun Corp. 2013 Exhibitor TowerJazz Japan Ltd. 2013 Exhibitor New Metal and Chemicals Corp. Ltd. 2013 Exhibitor NTT Advanced Technology Corp. 2013 Exhibitor Cascade Microtech Inc. 2013 Exhibitor Nagase & Co. Ltd. 2013 Exhibitor Synopsys 2013 Exhibitor Origin Electric Co. Ltd. 2013 Exhibitor Chipworks 2013 Exhibitor Silicon Frontline 2013 Exhibitor Nano Science Corp. 2013 Exhibitor Mentor Graphics Japan Co. Ltd. 2013 Exhibitor Showa Denko K.K. 2013 Exhibitor ABB Switzerland Ltd 2012 Sponsor Agilent 2012 Exhibitor Alpha & Omega Semiconductor 2012 Sponsor Applied Materials, Inc 2012 Sponsor Ascatron AB 2012 Exhibitor Azzurro 2012 Exhibitor Cascade Microtech, Inc. 2012 Exhibitor Chipworks 2012 Exhibitor Crosslight Software Inc 2012 Display ECPE European Center for Power Electronics 2012 Exhibitor Epigan NV 2012 Exhibitor Fairchild Semiconductor 2012 Sponsor Fuji Electric Europe GmbH 2012 Sponsor IMEC 2012 Exhibitor Infineon Technologies 2012 Sponsor International Rectifier 2012 Sponsor Magwel 2012 Exhibitor MC2 Technologies 2012 Exhibitor MicroGaN GmbH 2012 Sponsor+Display Mitsubishi Electric Corporation 2012 Sponsor Norstel AB 2012 Exhibitor NTT Advanced Technology Corp. 2012 Exhibitor NXP 2012 Sponsor ON Semiconductor 2012 Exhibitor Semikron International GmbH 2012 Sponsor Silicon Frontline Technology 2012 Exhibitor Silvaco Europe Ltd 2012 Exhibitor STMicroelectronics Srl 2012 Sponsor Synopsys 2012 Exhibitor Tower Semiconductor USA Inc. 2012 Display
ISPSD 2014 Plenary Talks
Power Architectures for Current and Future High Performance Computers
Dr. Paul Coteus, IBM Fellow, IBM, USA
Virtual Testing of High Power Devices at the Rim of Safe Operating Area and Beyond
Prof. Gerhard Wachutka, Munich University of Technology, Germany
Very High Power Converter Technologies (TBD)
Mr. Hidehiko Kikuchi, Corporate Vice President, Toshiba Mitsubishi-Electric Industrial Systems Corporation (TEMIC), Japan
ISPSD 2014 Travel Information
As ISPSD is an international conference, the organizers realize that each attendee will have unique travel requirements. Thus, several travel options for attending the conference are outlined below. If you have any questions or comments, please feel free to contact us using the information provided on the contact page.
Traveling from Kona Airport (KOA) to the Hilton
ISPSD '14 has arranged for shuttle service between KOA aiport and the Hilton Waikoloa Village. The shuttle will be provided through speedishuttle at a reduced rate. If you require the use of the shuttle, please book a seat using the online website provided here.
If you prefer the use of a rental car, National Car Rental does operate on the island.https://www.nationalcar.com/
When departing the Kona International Airport, turn left (north) onto Highway 19 for approximately 20 minutes. Continue until you see the Waikoloa Beach Drive turnoff to the left (west) of the highway. Along Waikoloa Beach Drive, you will pass four stop signs. Just after the fourth stop sign, you will see the entrance to Hilton Waikoloa Village on the left.
ISPSD 2014 Hotel Accommodations
ISPSD 2014 will be held at the Hilton Waikoloa Village. The conference venue is a resort hotel, and a block of discounted rooms has been set aside for ISPSD attendees. We encourage every attendee to stay at the resort in order to fully participate in the many technical and social activities available during the conference. The number of rooms in our block is limited, so please book your room as early as possible.
A website has been set up by the Hilton to allow attendees to easily book rooms in our room block and access our excellent room rates. Please use the Hilton Hotel Website to make a hotel room reservation at the Hilton Waikoloa Village.
You may also book a room in our block by calling 1-800-HILTONS and using the group code “ISP”.
ISPSD 2014 Visas
The organization team for ISPSD 2014 recognizes that some attendees and presenters will require visas in order to enter the Unites States. Per IEEE's new policy, the confirmation letter of your registration will also serve as the letter of invitation for visa application purposes. Please register early and print out the confirmation/invitation letter signed by the general chair sent to you via email, and start your visa process as soon as you can. In some cases, the visa process may take up to three months. If you have any questions regarding US visas, please contact the General Chair at email@example.com.
The International Symposium on Power Semiconductor Devices and ICs (ISPSD) brings together the world's foremost experts on power devices and power integrated circuit technologies and applications. It has become the premier international conference in this field, drawing an annual attendance of about 400 engineers, scientists, students, and professors.
In 2014, ISPSD will return to Hawaii for the first time in nearly 20 years. The conference will be held on the beautiful Big Island of Hawaii, which includes two active volcanoes, the tallest mountain on the planet, beautiful beaches, abundant hiking, snorkeling, and many other outdoor adventures. The Hilton Waikoloa Village Resort, our conference venue, features several on-site restaurants (including European, Japanese, and Chinese cuisine), numerous indoor and outdoor meeting spaces, swimming pools with waterfalls, a private lagoon, and even a live dolphin experience.
ISPSD 2014 will open with an all-day short-course lecture series on June 15, followed by four full days of technical sessions (June 16 - 19). Sessions will run sequentially, with no parallel sessions, enabling participants to listen to, and ask questions of, every presenter. Frequent breaks will be provided and several social events are planned (including a genuine Hawaiian Luau) to allow conference attendees to network and exchange ideas in an informal setting. In addition, exhibitors' booths will provide an opportunity for participants to learn about the equipment and services of companies that support the power electronics industry.
The ISPSD 2014 organizing committee is working hard to insure that this conference will be a success. The most important factors in that success will be the high-quality contributions of prospective authors and the participation of power device enthusiasts from all over the world. Please submit your abstracts, register early, spread the word to your friends and colleagues, and help us to make ISPSD 2014 a valuable and memorable experience for all.
Don DisneyGeneral Chair
Announcements Important Dates
Jan. 2014: Conference Registration Opens Jan. 15
Registration for ISPSD 2014 will open on January 15th, 2014. To register, please use the "Registration" button below.
Nov. 2013: Abstract Submissions Closed
Abstract submissions for ISPSD 2014 are now closed. The organizing team would like to thank everybody who has taken the time to submit an abstract. Acceptance notifications will be released by December 20th, 2013. To register, please use the "Registration" button below.
Late-News submission deadline
March 30th, 2014
Early registration deadline
May 1st, 2014
Manuscript submission deadline
March 15, 2014
Date of conference
June 15-19, 2014
Executive Committee Members
Technical Program Chair
Prof. Z. John Shen
llinois Institute of Technology
Publicity and Exhibits Chair
Local Arrangements Chair
Prof. Wai Tung Ng
University of Toronto
Short Course Chair
Past General Chair
MaxPower Semiconductor Inc.
ISPSD 2014 Technical Committee
Technical Program Committee ChairZ. John Shen, Illinois Institute of Technology, USA
Technical Program Committee Vice ChairsKuang Sheng, Zhejiang University, China
Stefan Linder, ABB, Switzerland
High Voltage SubcommitteeHamza Yilmaz, Alpha & Omega Semiconductor, USA (Subcommittee Chair)
Reinhard Herzer, Semikron, Germany
Young Chul Choi, Fairchild Semiconductor, Korea
Andrea Irace, University of Napoli, Italy
Nando Kaminski, University of Bremen, Germany
Jan Vobecky, ABB, Switzerland
Bo Zhang, University of Electronic Science and Technology of China, China
Ichiro Omura, Kyushu Institute of Technology, Japan
Tadaharu Minato, Mitsubishi Electric, Japan
Junichi Sakano, Hitachi, Japan
Tomoyuki Yamazaki, Fuji Electric Systems, Japan
Anup Bhalla, United Silicon Carbide, USA
Ali Salih, ON Semiconductor, USA
Chongman Yun, TrinnoTech, Korea
Low Voltage SubcommitteeJun Zeng, MaxPower Semiconductor, USA (Subcommittee Chair)
Angelo Magri, STMicroelectronics, Italy
Phil Rutter, NXP, UK
Ritu Sodhi, Fairchild Semiconductor, India
Yusuke Kawaguchi, Toshiba Corporation, Japan
Yoshinao Miura, Renesas Electronics, Japan
Shinji Kunori, Shindengen, Japan
Vijay Parthasarathy, Maxim Integrated Products, USA
Dev Alok Girdhar, Intersil, USA
Jeng Gong, Tung-Hai University, Taiwan
Integrated Power SubcommitteeSujit Banerjee, Monolith Semiconductor, USA (Subcommittee Chair)
Rob van Dalen, NXP Semiconductors, The Netherlands
Tanya Trajkovic, Cambridge Microelectronics, UK
Giuseppe Croce , STMicroelectronics, Italy
Akio Tamagawa, Renesas Electronics, Japan
Masayasu Ishiko, Toyota Central R&D Labs, Japan
Weifeng Sun, Southeast University, China
Tomohide Terashima, Mitsubishi Electric, Japan
Il-Yong Park, GlobalFoundries, USA
Olivier Trescases, University of Toronto, Canada
Jun Cai, Texas Instruments, USA
Y.C. Jong, TSMC, Taiwan
Alexander Hölke, X-FAB, Malaysia
Wide Bandgap SubcommitteeDavid Sheridan, RFMD, USA (Subcommittee Chair)
Roland Rupp, Infineon Technologies, Germany
Frédéric Morancho, LAAS-CNRS, France
Mikael Ostling, KTH, Royal Institute of Technology, Sweden
Kevin J. Chen, Hong Kong University of Science and Technology, China
Nariaki Ikeda, Furukawa Electric, Japan
Noriyuki Iwamuro, Tsukuba University, Japan
Lin Cheng, Cree, USA
Ranbir Singh, GeneSiC, USA
Peter Losee, GE, USA
Kuang Sheng, Zhejiang University, China
Anping Zhang, Xi'an Jiaotong University, China
Jai Kwang Shin, Samsung, Korea
Yasuhiro Uemoto, Panasonic, Japan
Packaging and Integration SubcommitteeKimimori Hamada, Toyota Motor, Japan (Subcommittee Chair)
Reinhold Bayerer, Infineon Technologies, Germany
Mark Pavier, International Rectifier, UK
Josef Lutz, Technical University of Chemnitz, Germany
Alberta Castellazzi, Nottingham University, UK
Kazuhiro Tsuruta, Denso Corporation, Japan
Katsuaki Saito, Hitachi, Japan
Khai Ngo, Virginia Tech, USA
Zhenxian, Liang, Oak Ridge National Laboratory, USA